Deposition

1. PECVD - Oxford Instruments PlasmaPro 80 Plasma Enhanced Chemical Vapor Deposition
2. ALD - Oxford Instruments FlexAL Atomic Layer Deposition
3. Electron beam + thermal evaporator - Kurt J. Lesker PVD200 evaporator
4. LAB-18 Magnetron Sputtering System - Kurt J. Lesker LAB-18
5. CMS-18 Magnetron Sputtering System - Kurt J. Lesker CMS-18
6. ALD II - Ultratech Fiji G2

Etching

1. RIE - Oxford Instruments PlasmaPro 80 Reactive Ion Etcher
2. Plasma cleaner - Harrick Plasma plasma cleaner

Wet processing

1. Acid and Base bench - Air-Control CS-50D High Performance Chemical Wet Process Station
2. Solvent bench - Air-Control Model 4F Exhausted Laminar Flow Chemical Wet Process Station

Lithography

1. Mask aligner - Karl Suss MA6 Gen 4 mask aligner
2. Spin coater - SPS Polos spin coater
3. Hotplate - SPS Polos hotplate
4. Oven - Some oven

Characterization

1. Light Microscope - Zeiss Axioscope 6 light microscope
2. Profilometer - Veeco Dektak XT profilometer
3. XPS - Thermo Scientific NEXSA X-ray Photoelectron Spectrometer
4. Ellipsometer - Sentech SENresearch 4.0 Spectroscopic Ellipsometer

The Cleanroom

• Area: 70 m2
• Classification: ISO 6 – ISO 5, with local ISO 4
• Toxic gas sensors: 6 pcs
• Oxygen sensors: 2 pcs
• Yellow room: 15 m3
• Technical area: 40 m3

Infrastructure:

• UHP inert gases, tech. N2, CDA, vacuum, DI water, chemicals neutralization system
• Cooling capacity:
• Air exchange:
• Electrical power capacity:

Thin film deposition laboratory

• Area: 152 m2
• Gases: UHP Ar, N2, O2. Technical N2, CDA
• Cooling Capacity: 22 kW (Ducted AC unit)

Instrument Capabilities:

• Magnetron sputtering system with 2” RF and 2x 2” DC sources
• Magnetron sputtering system with 3” RF, DC and pulsed DC sources
• Plasma enhanced atomic layer deposition system
• PECVD dual zone tube furnace
• Spectroscopic ellipsometer (190 nm - 2500 nm)
• Laminar box for clean environment sample handling